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'description_highlight' => '集微网消息,台媒报道称,台积电竹南先进封测厂 AP6 今年第三季起即将量产,除了既有的 2D / 2.5D <em>封装</em>外,也将进行大规模的 3D <em>封装</em>量产计划,引发市场密切关注。过去数年来,台积电先进<em>封装</em>技',
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'title_highlight' => '台积电打响先进<em>封装</em>“攻坚战”',
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'description_highlight' => '如果说此前<em>封装</em>技术还被认为是归于产业链后端流程的技术,现在"时代变了"。台积电在官网关于 3D <em>封装</em>如此介绍,计算工作的负载在过去十年中的发展可能比前四个十年都要大。云计算、大数据分析、人工智能 (A',
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'description' => 'Yole 最近的研究报告指出,中国大陆市场存储芯片的崛起、倒装芯片 DRAM 和 3D 堆叠技术的发展,将会给本土封装厂商带来重大利好。数据显示,从市场份额来看,2020 年到 2026 年,整体存储',
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'title_highlight' => 'Yole:中国大陆存储芯片厂商极大地推动了本土封测厂的繁荣',
'content' => '...崛起、倒装芯片 DRAM 和 3D 堆叠技术的发展,将会给本土<em>封装</em>厂商带来重大利好。数据显示,从市场份额来看,2020 年到 2026 年,整体存储<em>封装</em>市场将以 7% 的复合年增长率增长,至 2026 年将达到 198 亿美元。DRAM <em>封装</em>将是 2026 年最...',
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'description_highlight' => 'Yole 最近的研究报告指出,中国大陆市场存储芯片的崛起、倒装芯片 DRAM 和 3D 堆叠技术的发展,将会给本土<em>封装</em>厂商带来重大利好。数据显示,从市场份额来看,2020 年到 2026 年,整体存储',
'inputtime' => '1651817990',
'updatetime' => '1651817990',
'thumb' => NULL,
'url' => '/youxi-100661',
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'url' => 'https://www.dh3g.com/s-正在',
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'url' => 'https://www.dh3g.com/s-数据',
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8 =>
array (
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'title' => '长电科技上半年延续高增长 大力布局先进封装功不可没',
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'description' => '5G通信与新能源汽车引领的新一轮科技迭代浪潮,将全球半导体行业引入了新一轮景气周期。面对强劲市场需求,包括封测在内的行业相关企业普遍迎来业绩利好。日前,国内封测龙头长电科技(股票代码600584)发布',
'catid' => '7',
'title_highlight' => '长电科技上半年延续高增长 大力布局先进<em>封装</em>功不可没',
'content' => '...不仅来自持续增长的市场需求,也源自企业对半导体先进<em>封装</em>技术的前瞻性投入,使长电科技能够良好匹配5G通信、高性能计算、大数据、消费电子、汽车等重要领域对于先进<em>封装</em>芯片成品的大量需求。进入后摩尔时代,<em>封装</em>技...',
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'description_highlight' => '5G通信与新能源汽车引领的新一轮科技迭代浪潮,将全球半导体行业引入了新一轮景气周期。面对强劲市场需求,包括封测在内的行业相关企业普遍迎来业绩利好。日前,国内封测龙头长电科技(股票代码600584)发布',
'inputtime' => '1651809933',
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'thumb' => NULL,
'url' => '/youxi-86300',
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array (
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'description' => 'IT之家 11 月 29 日消息,华为技术有限公司在近日公开了"芯片封装组件、电子设备及芯片封装组件的制作方法"专利,公开号为 CN113707623A。企查查专利摘要显示,本申请公开了一种芯片封装组',
'catid' => '7',
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'title' => '中科院张国平:我国先进封装材料发展任重道远',
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'description' => '在 14 日举行的 ICEPT 2021 电子封装技术国际会议上,中国科学院深圳理工大学先进材料科学与工程研究所副所长张国平发表主题演讲表示,先进封装已成为超越摩尔定律的关键赛道,但国产化仍然任重道远',
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'title_highlight' => '中科院张国平:我国先进<em>封装</em>材料发展任重道远',
'content' => '在 14 日举行的 ICEPT 2021 电子<em>封装</em>技术国际会议上,中国科学院深圳理工大学先进材料科学与工程研究所副所长张国平发表主题演讲表示,先进<em>封装</em>已成为超越摩尔定律的关键赛道,但国产化仍然任重道远。张国平称,随着台积...',
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'description_highlight' => '在 14 日举行的 ICEPT 2021 电子<em>封装</em>技术国际会议上,中国科学院深圳理工大学先进材料科学与工程研究所副所长张国平发表主题演讲表示,先进<em>封装</em>已成为超越摩尔定律的关键赛道,但国产化仍然任重道远',
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